3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
This paper introduces the current developments of the SPIF (Syst`eme de Prototypage `a Implantation rapide et Faible coˆut) project. The goal of SPIF is to provide a low cost envi...
A deterministic behavior of systems composed of several modules is a desirable design goal. Assembling a complex system from components requires also a high degree of re-usability....
As a wide variety of interaction devices, modalities has to be supported by user interface developers, model-based user interface development gets increasing attention. Especially ...
This paper presents the software architecture and implementation of the problem solving environment (PSE) PELLPACK for modeling physical objects described by partial differential ...
Elias N. Houstis, John R. Rice, Sanjiva Weerawaran...