159 search results - page 17 / 32 » A Codesign Environment Supporting Hardware Software Modeling... |
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ADAEUROPE
1997
Springer
14 years 18 days ago
1997
Springer
This paper introduces the current developments of the SPIF (Syst`eme de Prototypage `a Implantation rapide et Faible coˆut) project. The goal of SPIF is to provide a low cost envi...
FUIN
2008
13 years 8 months ago
2008
A deterministic behavior of systems composed of several modules is a desirable design goal. Assembling a complex system from components requires also a high degree of re-usability....
HCI
2007
13 years 10 months ago
2007
As a wide variety of interaction devices, modalities has to be supported by user interface developers, model-based user interface development gets increasing attention. Especially ...
TOMS
1998
13 years 8 months ago
1998
This paper presents the software architecture and implementation of the problem solving environment (PSE) PELLPACK for modeling physical objects described by partial differential ...