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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 5 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
ICCV
2009
IEEE
13 years 5 months ago
BLOGS: Balanced local and global search for non-degenerate two view epipolar geometry
This work considers the problem of estimating the epipolar geometry between two cameras without needing a prespecified set of correspondences. It is capable of resolving the epipo...
Aveek S. Brahmachari, Sudeep Sarkar
ICCV
2009
IEEE
13 years 5 months ago
On optimizing subspaces for face recognition
We propose a subspace learning algorithm for face recognition by directly optimizing recognition performance scores. Our approach is motivated by the following observations: 1) Di...
Jilin Tu, Xiaoming Liu, Peter Henry Tu
ICDCS
2009
IEEE
13 years 5 months ago
Selective Protection: A Cost-Efficient Backup Scheme for Link State Routing
In recent years, there are substantial demands to reduce packet loss in the Internet. Among the schemes proposed, finding backup paths in advance is considered to be an effective ...
Meijia Hou, Dan Wang, Mingwei Xu, Jiahai Yang
ICSM
2009
IEEE
13 years 5 months ago
Decomposing object-oriented class modules using an agglomerative clustering technique
Software can be considered a live entity, as it undergoes many alterations throughout its lifecycle. Furthermore, developers do not usually retain a good design in favor of adding...
Marios Fokaefs, Nikolaos Tsantalis, Alexander Chat...
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