Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
This work considers the problem of estimating the epipolar geometry between two cameras without needing a prespecified set of correspondences. It is capable of resolving the epipo...
We propose a subspace learning algorithm for face recognition by directly optimizing recognition performance scores. Our approach is motivated by the following observations: 1) Di...
In recent years, there are substantial demands to reduce packet loss in the Internet. Among the schemes proposed, finding backup paths in advance is considered to be an effective ...
Software can be considered a live entity, as it undergoes many alterations throughout its lifecycle. Furthermore, developers do not usually retain a good design in favor of adding...
Marios Fokaefs, Nikolaos Tsantalis, Alexander Chat...