369 search results - page 52 / 74 » A High Performance Totally Ordered Multicast Protocol |
CORR
2008
Springer
13 years 8 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
ISCC
2000
IEEE
14 years 6 days ago
2000
IEEE
A new medium access control (MAC) protocol for mobile wireless communications is presented and investigated. We explore, via an extensive simulation study, the performance of the ...
IFIP
2003
Springer
14 years 1 months ago
2003
Springer
The use of directional antenna in wireless ad hoc networks potentially increases simultaneous communication by directing the transmitting and receiving beams towards the receiver a...
MOBIHOC
2008
ACM
14 years 7 months ago
2008
ACM
It was shown recently [7?9], under quite general conditions, that retransmission-based protocols may result in power-law delays and possibly zero throughput even if the distributi...
VTC
2008
IEEE
14 years 2 months ago
2008
IEEE
—In this paper, we propose a generalized cooperative signal transmission model for wireless networks. In this model, the source, the destination, and an arbitrary number of relay...