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MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
HPCA
2011
IEEE
12 years 11 months ago
2011
IEEE
Over the last twenty years the interfaces for accessing persistent storage within a computer system have remained essentially unchanged. Simply put, seek, read and write have de...
SPAA
2010
ACM
14 years 9 days ago
2010
ACM
TL2 and similar STM algorithms deliver high scalability based on write-locking and invisible readers. In fact, no modern STM design locks to read along its common execution path b...
VEE
2009
ACM
14 years 2 months ago
2009
ACM
r of high-level languages lies in their abstraction over hardware and software complexity, leading to greater security, better reliability, and lower development costs. However, o...
IPPS
2008
IEEE
14 years 1 months ago
2008
IEEE
In this paper, we introduce the new technique of HighConfidence Software Monitoring (HCSM), which allows one to perform software monitoring with bounded overhead and concomitantl...