Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
Point&Connect (P&C) offers an intuitive and resilient device pairing solution on standard mobile phones. Its operation follows the simple sequence of point-and-connect: wh...
Complex toolsets can be difficult to use. User interfaces can help by guiding users through the alternative choices that might be possible at any given time, but this tends to loc...
Timothy J. Sliski, Matthew P. Billmers, Lori A. Cl...
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
Yang Ding, Mahmut T. Kandemir, Mary Jane Irwin, Pa...
Splatting is widely applied in many areas, including volume, point-based, and image-based rendering. Improvements to splatting, such as eliminating popping and color bleeding, occ...
Jian Huang, Roger Crawfis, Naeem Shareef, Klaus Mu...