3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
At the heart of all garbage collectors lies the process of identifying and processing reference fields within an object. Despite its key role, and evidence of many different impl...
Robin Garner, Stephen M. Blackburn, Daniel Frampto...
For the worst-case execution time (WCET) analysis, especially loops are an inherent source of unpredictability and loss of precision. This is caused by the difficulty to obtain sa...
Paul Lokuciejewski, Heiko Falk, Martin Schwarzer, ...
We have previously proposed a new technique for the communication-free adaptive refinement of tetrahedral meshes that works for all configurations. Implementations of the scheme mu...
—In the era of multi-core, computer vision has emerged as an exciting application area which promises to continue to drive the demand for both more powerful and more energy effi...
Sravanthi Kota Venkata, Ikkjin Ahn, Donghwan Jeon,...