1017 search results - page 143 / 204 » A routing algorithm for flip-chip design |
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
INFOCOM
2009
IEEE
14 years 2 months ago
2009
IEEE
—In layered networks, a single failure at a lower layer may cause multiple failures in the upper layers. As a result, traditional schemes that protect against single failures may...
EUROMICRO
2007
IEEE
14 years 2 months ago
2007
IEEE
Multicast network services advantageously complement multimedia information and communication technologies, as they open up the realm for highly scalable multicustomer application...
ISORC
2007
IEEE
14 years 2 months ago
2007
IEEE
Due to the special characteristics (limited battery power, limited computing capability, low bandwidth, need to collect sensor data from multiple fixed-location source nodes to a...
IPPS
2005
IEEE
14 years 1 months ago
2005
IEEE
Multicast applications for large-scale Mobile Ad hoc NETworks (MANETs) require an efficient and effective Quality of Service (QoS)-aware multicast model. The new requirements to ...