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» A snap-on placement tool
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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
14 years 1 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
ISPD
1997
ACM
68views Hardware» more  ISPD 1997»
13 years 12 months ago
Faster minimization of linear wirelength for global placement
A linear wirelength objective more e ectively captures timing, congestion, and other global placement considerations than a squared wirelength objective. The GORDIAN-L cell placem...
Charles J. Alpert, Tony F. Chan, Dennis J.-H. Huan...
UIST
2006
ACM
14 years 1 months ago
A direct texture placement and editing interface
The creation of most models used in computer animation and computer games requires the assignment of texture coordinates, texture painting, and texture editing. We present a novel...
Yotam I. Gingold, Philip L. Davidson, Jefferson Y....
ICCAD
2006
IEEE
149views Hardware» more  ICCAD 2006»
14 years 4 months ago
Thermal sensor allocation and placement for reconfigurable systems
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...
DAC
2005
ACM
14 years 8 months ago
Physically-aware HW-SW partitioning for reconfigurable architectures with partial dynamic reconfiguration
Many reconfigurable architectures offer partial dynamic configurability, but current system-level tools cannot guarantee feasible implementations when exploiting this feature. We ...
Sudarshan Banerjee, Elaheh Bozorgzadeh, Nikil D. D...