I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
Transistor leakage is poised to become the dominant source of power dissipation in digital systems, and reconfigurable devices are not immune to this problem. Modern FPGAs already...
— This work aims at minimize the cost of answering snapshot multi-predicate queries in high-communication-cost networks. High-communication-cost (HCC) networks is a family of net...
In this paper, we describe an accurate metric (perimeter-degree) for measuring interconnection complexity and effective use of it for controlling congestion in a multilevel framew...
Navaratnasothie Selvakkumaran, Phiroze N. Parakh, ...
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...