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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 2 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
JRTIP
2008
249views more  JRTIP 2008»
13 years 8 months ago
Model-based mapping of reconfigurable image registration on FPGA platforms
Abstract Image registration is a computationally intensive application in the medical imaging domain that places stringent requirements on performance and memory management efficie...
Mainak Sen, Yashwanth Hemaraj, William Plishker, R...
CODES
2009
IEEE
14 years 3 months ago
Exploiting data-redundancy in reliability-aware networked embedded system design
This paper presents a system-level design methodology for networked embedded systems that exploits existing data-redundancy to increase their reliability. The presented approach n...
Martin Lukasiewycz, Michael Glaß, Jürge...
TCAD
2002
146views more  TCAD 2002»
13 years 8 months ago
Static scheduling of multidomain circuits for fast functional verification
With the advent of system-on-a-chip design, many application specific integrated circuits (ASICs) now require multiple design clocks that operate asynchronously to each other. This...
Murali Kudlugi, Russell Tessier
CODES
2008
IEEE
14 years 2 months ago
System-level mitigation of WID leakage power variability using body-bias islands
Adaptive Body Biasing (ABB) is a popularly used technique to mitigate the increasing impact of manufacturing process variations on leakage power dissipation. The efficacy of the ...
Siddharth Garg, Diana Marculescu