Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...
Lide Zhang, Lan S. Bai, Robert P. Dick, Li Shang, ...
Abstract--Multi-core processors with accelerators are becoming commodity components for high-performance computing at scale. While accelerator-based processors have been studied in...
M. Mustafa Rafique, Ali Raza Butt, Dimitrios S. Ni...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Multimedia applications are emerging in education, information dissemination, entertainment, as well as many other applications. The stringent requirements of such applications ma...
AdvanceobjectorientedcomputingplatformsuchastheCommonObjectRequestBrokerArchitecture (CORBA) provides a conducive and standardized framework for the development of distributed appl...
Hung Keng Pung, Wynne Hsu, Bhawani S. Sapkota, Law...