98 search results - page 11 / 20 » Advanced Module Packaging Method |
SEW
2006
IEEE
14 years 22 days ago
2006
IEEE
Pseudo-exhaustive testing uses the empirical observation that, for broad classes of software, a fault is likely triggered by only a few variables interacting. The method takes adv...
ASPDAC
2006
ACM
14 years 21 days ago
2006
ACM
– In real-time multimedia processing systems a very large part of the power consumption is due to the data storage and data transfer. Moreover, the area cost is often largely dom...
IJVR
2008
13 years 6 months ago
2008
This paper presents an analysis of how and why a new generation of virtual reality peripherals affect virtual reality in general, and its uses for education in particular. We descr...
ISCAS
2007
IEEE
14 years 1 months ago
2007
IEEE
—Systems on Chip (SoCs) congregate multiple modules and advanced interconnection schemes, such as networks on chip (NoCs). One relevant problem in SoC design is module mapping on...
CAD
2007
Springer
13 years 6 months ago
2007
Springer
The recent advancement of solid freeform fabrication, design techniques and fundamental understanding of material properties in functionally graded materials has made it possible ...