1661 search results - page 245 / 333 » Advanced carving techniques |
CORR
2008
Springer
13 years 7 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
ANOR
2006
13 years 7 months ago
2006
Electron Microscopy is a valuable tool for the elucidation of the three-dimensional structure of macromolecular complexes. Knowledge about the macromolecular structure provides imp...
EOR
2008
13 years 7 months ago
2008
We consider the robust surgery loading problem for a hospital's operating theatre department, which concerns assigning surgeries and sufficient planned slack to operating roo...
CCE
2006
13 years 7 months ago
2006
The measurement and control of polymerization reactors is very challenging due to the complexity of the physical mechanisms and polymerization kinetics. In these reactors many imp...
CCE
2006
13 years 7 months ago
2006
Complex kinetic mechanisms involving thousands of reacting species and tens of thousands of reactions are currently required for the rational analysis of modern combustion systems...