In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
We consider the problem of learning a record matching package (classifier) in an active learning setting. In active learning, the learning algorithm picks the set of examples to ...
There is an increasing quantity of data with uncertainty arising from applications such as sensor network measurements, record linkage, and as output of mining algorithms. This un...
Detecting clusters or communities in large real-world graphs such as large social or information networks is a problem of considerable interest. In practice, one typically chooses...
Computing frequent itemsets is one of the most prominent problems in data mining. We introduce a new, related problem, called FREQSAT: given some itemset-interval pairs, does ther...