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» An Algorithm for Locating Logic Design Errors
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DAC
2012
ACM
12 years 4 days ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
HPCA
2009
IEEE
14 years 10 months ago
Blueshift: Designing processors for timing speculation from the ground up
Several recent processor designs have proposed to enhance performance by increasing the clock frequency to the point where timing faults occur, and by adding error-correcting supp...
Brian Greskamp, Lu Wan, Ulya R. Karpuzcu, Jeffrey ...
MOBICOM
2006
ACM
14 years 3 months ago
Multipath profile discrimination in TOA-based WLAN ranging with link layer frames
Indoor ranging and location in WLAN is possible through obtaining Round-Trip-Time (RTT) measurements at data link level. This procedure allows using the existing IEEE 802.11 WLAN ...
Marc Ciurana, Francisco Barceló, Sebastiano...
UIST
2005
ACM
14 years 3 months ago
Supporting interaction in augmented reality in the presence of uncertain spatial knowledge
A significant problem encounteredwhen building Augmented Reality (AR) systems is that all spatial knowledge about the world has uncertainty associated with it. This uncertainty m...
Enylton Machado Coelho, Blair MacIntyre, Simon Jul...
GIS
2006
ACM
13 years 9 months ago
Qualitative polyline similarity testing with applications to query-by-sketch, indexing and classification
We present an algorithm for polyline (and polygon) similarity testing that is based on the double-cross formalism. To determine the degree of similarity between two polylines, the...
Bart Kuijpers, Bart Moelans, Nico Van de Weghe