In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Several recent processor designs have proposed to enhance performance by increasing the clock frequency to the point where timing faults occur, and by adding error-correcting supp...
Brian Greskamp, Lu Wan, Ulya R. Karpuzcu, Jeffrey ...
Indoor ranging and location in WLAN is possible through obtaining Round-Trip-Time (RTT) measurements at data link level. This procedure allows using the existing IEEE 802.11 WLAN ...
A significant problem encounteredwhen building Augmented Reality (AR) systems is that all spatial knowledge about the world has uncertainty associated with it. This uncertainty m...
Enylton Machado Coelho, Blair MacIntyre, Simon Jul...
We present an algorithm for polyline (and polygon) similarity testing that is based on the double-cross formalism. To determine the degree of similarity between two polylines, the...