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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
13 years 5 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
IMR
2003
Springer
14 years 22 days ago
Combined Laplacian and Optimization-based Smoothing for Quadratic Mixed Surface Meshes
Quadratic elements place stringent requirements on a surface mesh smoother. One of the biggest challenges is that a good linear element may become invalid when mid-side nodes are ...
Zhijian Chen, Joseph R. Tristano, Wa Kwok
PLDI
2003
ACM
14 years 24 days ago
Taming the IXP network processor
We compile Nova, a new language designed for writing network processing applications, using a back end based on integer-linear programming (ILP) for register allocation, optimal b...
Lal George, Matthias Blume
INFOCOM
2006
IEEE
14 years 1 months ago
Maximum Throughput and Fair Bandwidth Allocation in Multi-Channel Wireless Mesh Networks
— Wireless mesh network is designed as an economical solution for last-mile broadband Internet access. In this paper, we study bandwidth allocation in multi-channel multihop wire...
Jian Tang, Guoliang Xue, Weiyi Zhang
SUTC
2006
IEEE
14 years 1 months ago
Schedules with Minimized Access Latency for Disseminating Dependent Information on Multiple Channels
In wireless mobile environments, data broadcasting is an effective approach to disseminate information to mobile clients. In some applications, the access pattern of all the data...
Kun-Feng Lin, Chuan-Ming Liu