Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
In recent years, co-clustering has emerged as a powerful data mining tool that can analyze dyadic data connecting two entities. However, almost all existing co-clustering techniqu...
Power minimization is a serious issue in wireless sensor networks to extend the lifetime and minimize costs. However, in order to gain an accurate understanding of issues regardin...
Recent advances in Dynamic Power Management (DPM) techniques have resulted in designs that support a rich set of power management options, both at the hardware and software levels...
Shrirang M. Yardi, Karthik Channakeshava, Michael ...
How can we generate realistic networks? In addition, how can we do so with a mathematically tractable model that allows for rigorous analysis of network properties? Real networks ...
Jure Leskovec, Deepayan Chakrabarti, Jon M. Kleinb...