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SLIP
2009
ACM
14 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ICDM
2008
IEEE
184views Data Mining» more  ICDM 2008»
14 years 1 months ago
Bayesian Co-clustering
In recent years, co-clustering has emerged as a powerful data mining tool that can analyze dyadic data connecting two entities. However, almost all existing co-clustering techniqu...
Hanhuai Shan, Arindam Banerjee
ICPPW
2008
IEEE
14 years 1 months ago
Energy Modeling of Processors in Wireless Sensor Networks Based on Petri Nets
Power minimization is a serious issue in wireless sensor networks to extend the lifetime and minimize costs. However, in order to gain an accurate understanding of issues regardin...
Ali Shareef, Yifeng Zhu
ICCD
2005
IEEE
176views Hardware» more  ICCD 2005»
14 years 4 months ago
A Formal Framework for Modeling and Analysis of System-Level Dynamic Power Management
Recent advances in Dynamic Power Management (DPM) techniques have resulted in designs that support a rich set of power management options, both at the hardware and software levels...
Shrirang M. Yardi, Karthik Channakeshava, Michael ...
JMLR
2010
157views more  JMLR 2010»
13 years 5 months ago
Kronecker Graphs: An Approach to Modeling Networks
How can we generate realistic networks? In addition, how can we do so with a mathematically tractable model that allows for rigorous analysis of network properties? Real networks ...
Jure Leskovec, Deepayan Chakrabarti, Jon M. Kleinb...