The paper proposes an efficient terminal and model order reduction method for compact modeling of interconnect circuits with many terminals. The new method is inspired by the rece...
Pu Liu, Sheldon X.-D. Tan, Boyuan Yan, Bruce McGau...
Heterogeneous embedded systems, where configurable or application specific hardware devices (FPGAs and ASICs) are used alongside traditional processors, are becoming more and more...
This paper describes the design and evaluation of a robust integrator for software-implemented control systems. The integrator is constructed as a generic component in the Simulin...
Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...