1398 search results - page 150 / 280 » Application-Specific Integrated Circuits |
GECCO
2003
Springer
14 years 1 months ago
2003
Springer
Power consumption and portability issues are becoming increasingly significant in embedded system architectures. Therefore, it is important that chip architects and integrated circ...
DAC
1996
ACM
14 years 6 days ago
1996
ACM
: Electromigration induced degradation in integrated circuits has been accelerated by continuous scaling of device dimensions. We present a methodology for synthesizing high-reliab...
DAC
2005
ACM
13 years 10 months ago
2005
ACM
Traditional corner analysis fails to guarantee a target yield for a given performance metric. However, recently proposed solutions, in the form of statistical timing analysis, whi...
MR
2002
13 years 7 months ago
2002
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....
MR
2002
13 years 7 months ago
2002
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...