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104
Voted
ICCAD
2010
IEEE
126views Hardware» more  ICCAD 2010»
15 years 21 days ago
Characterizing the lifetime reliability of manycore processors with core-level redundancy
With aggressive technology scaling, integrated circuits suffer from everincreasing wearout effects and their lifetime reliability has become a serious concern for the industry. Fo...
Lin Huang, Qiang Xu
147
Voted
VTC
2010
IEEE
150views Communications» more  VTC 2010»
15 years 17 days ago
Millimeter-Wave CMOS Antennas and RFIC Parameter Extraction for Vehicular Applications
This paper reviews recent developments in vehicular radar at 60 GHz and above, with a focus on low cost integrated antennas. We investigate a number of radar and communication ante...
Felix Gutierrez Jr., Theodore S. Rappaport, James ...
136
Voted
MEMICS
2010
14 years 9 months ago
Monitoring and Control of Temperature in Networks-on-Chip
Abstract. Increasing integration densities and the emergence of nanotechnology cause issues related to reliability and power consumption to become dominant factors for the design o...
Tim Wegner, Claas Cornelius, Andreas Tockhorn, Dir...
138
Voted
COMCOM
1999
164views more  COMCOM 1999»
15 years 2 months ago
Support QoS in IP over ATM
An integrated service internet running real-time and multimedia applications is rapidly becoming a reality. Meanwhile, ATM technology is appearing in the marketplace. It is an imp...
Gung-Chou Lai, Ruay Shiung Chang
140
Voted
DAC
2009
ACM
16 years 3 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha