1398 search results - page 254 / 280 » Application-Specific Integrated Circuits |
IJCSA
2008
13 years 7 months ago
2008
This paper presents a comparison relating two different vision system architectures. The first one involves a smart sensor including analog processors allowing on-chip image proce...
ESWA
2007
13 years 7 months ago
2007
Packaging is classified as one of back-end processes in the integrated circuits (ICs) manufacturing, highly capital-intensive and involves complex processes. Unlike the front-end...
ET
2007
13 years 7 months ago
2007
Abstract In order to perform an on-chip test for characterizing both static and transmission parameters of embedded analog-to-digital converters (ADCs), this paper presents an osci...
TCAD
2008
13 years 7 months ago
2008
Abstract--Advances in very large-scale integration technology make clock skew more susceptible to process variations. Notwithstanding efficient exact zero-skew algorithms, clock sk...
TCAD
2008
13 years 7 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...