1398 search results - page 4 / 280 » Application-Specific Integrated Circuits |
AINA
2004
IEEE
13 years 11 months ago
2004
IEEE
As the demand for high bandwidth on the Internet increases, it is required to build next generation routers with the capability of forwarding multiple millions of packets per secon...
ASPDAC
2011
ACM
12 years 11 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ASAP
2008
IEEE
14 years 2 months ago
2008
IEEE
Process technology has reduced in size such that it is possible to implement complete applicationspecific architectures as Systems-on-Chip (SoCs) using both Application-Specific I...
EVOW
2001
Springer
14 years 6 days ago
2001
Springer
The integrated circuits design flow is rapidly moving towards higher description levels. However, test-related activities are lacking behind this trend, mainly since effective faul...
FPL
2009
Springer
14 years 9 days ago
2009
Springer
In this paper we present a verification platform designed for HyperTransport 3.x (HT3) applications. HyperTransport 3.x is a very low latency and high bandwidth chip-tochip interc...