12745 search results - page 2331 / 2549 » Automating test automation |
158
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
157
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
196
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
123
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
In this paper, we propose an effective algorithm flow to handle largescale mixed-size placement. The basic idea is to use floorplanning to guide the placement of objects at the gl...
114
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DAC
2009
ACM
16 years 5 months ago
2009
ACM
As VLSI technology enters the nanoscale regime, interconnect delay has become the bottleneck of the circuit timing. As one of the most powerful techniques for interconnect optimiz...