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142
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DAC
2006
ACM
16 years 5 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
148
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DAC
2006
ACM
16 years 5 months ago
2006
ACM
ing models and HW-SW Interfaces Abstraction for Multi-Processor SoC Ahmed A. Jerraya TIMA Laboratory 46 Ave Felix Viallet 38031 Grenoble CEDEX, France +33476574759 Ahmed.Jerraya@im...
149
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DAC
2006
ACM
16 years 5 months ago
2006
ACM
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...
126
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DAC
2006
ACM
16 years 5 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
141
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DAC
2006
ACM
16 years 5 months ago
2006
ACM
Networks-on-Chip (NoC) architectures provide a scalable solution to on-chip communication problem but the bandwidth offered by NoCs can be utilized efficiently only in presence of...