A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
Multiple memory banks design is employed in many high performance DSP processors. This architectural feature supports higher memory bandwidth by allowing multiple data memory acce...
Chun Jason Xue, Tiantian Liu, Zili Shao, Jingtong ...
This paper introduces a novel energy minimization method, namely iterated cross entropy with partition strategy (ICEPS), into the Markov random field theory. The solver, which is...
This paper presents a compiler technique that reduces the energy consumption of the memory subsystem, for an off-chip partitioned memory architecture having multiple memory banks ...
Achieving the dimensional integrity for a complex structural assembly is a demanding task due to the manufacturing variations of parts and the tolerance relationship between them....