Supporting continuous sensing applications on mobile phones is challenging because of the resource demands of long-term sensing, inference and communication algorithms. We present...
Hong Lu, Jun Yang, Zhigang Liu, Nicholas D. Lane, ...
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Background: The way mechanical stress is distributed inside and propagated by proteins and other biopolymers largely defines their function. Yet, determining the network of intera...
Wolfram Stacklies, Christian Seifert, Frauke Graet...
We determine the robust Nash equilibrium (RNE) for a wide range of problems in communications systems and networks that are faced with uncertainty in their parameters’ values. T...
Saeedeh Parsaeefard, Ahmad R. Sharafat, Mihaela va...
—Aggressive technology scaling to 45nm and below introduces serious reliability challenges to the design of microprocessors. Since a large fraction of chip area is devoted to on-...
Amin Ansari, Shantanu Gupta, Shuguang Feng, Scott ...