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137
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CODES
2008
IEEE
15 years 9 months ago
Intra- and inter-processor hybrid performance modeling for MPSoC architectures
The heterogeneity of modern MPSoC architectures, coupled with the increasing complexity of the applications mapped onto them has recently led to a lot of interest in hybrid perfor...
Frank E. B. Ophelders, Samarjit Chakraborty, Henk ...
NOMS
2008
IEEE
175views Communications» more  NOMS 2008»
15 years 9 months ago
Analysis of application performance and its change via representative application signatures
Abstract—Application servers are a core component of a multitier architecture that has become the industry standard for building scalable client-server applications. A client com...
Ningfang Mi, Ludmila Cherkasova, Kivanc M. Ozonat,...
119
Voted
CODES
2007
IEEE
15 years 9 months ago
Scheduling and voltage scaling for energy/reliability trade-offs in fault-tolerant time-triggered embedded systems
In this paper we present an approach to the scheduling and voltage scaling of low-power fault-tolerant hard real-time applications mapped on distributed heterogeneous embedded sys...
Paul Pop, Kåre Harbo Poulsen, Viacheslav Izo...
CODES
2007
IEEE
15 years 9 months ago
Smart driver for power reduction in next generation bistable electrophoretic display technology
Microencapsulated electrophoretic displays (EPDs) are quickly emerging as an important technology for use in battery-powered portable computing devices. Thanks to bistability and ...
Michael A. Baker, Aviral Shrivastava, Karam S. Cha...
CODES
2007
IEEE
15 years 9 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick