Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Backgorund: The completion of the Human Genome Project has resulted in large quantities of biological data which are proving difficult to manage and integrate effectively. There i...
Paolo Romano 0001, Domenico Marra, Luciano Milanes...
We obtain a new formalism for concurrent object-oriented languages by extending Abadi and Cardelli's imperative object calculus with operators for concurrency from the -calc...
Electronic System Level (ESL) design manages the complexity of todays systems by using abstract models. In this context Transaction Level Modeling (TLM) is state-of-theart for desc...
Abstract--This paper presents a GALS-compatible circuitswitched on-chip network that is well suited for use in many-core platforms targeting streaming DSP and embedded applications...