252 search results - page 51 / 51 » Composable Lightweight Processors |
110
Voted
NOCS
2010
IEEE
15 years 1 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
153
Voted
ICPADS
2010
IEEE
15 years 17 days ago
2010
IEEE
To fully tap into the potential of heterogeneous machines composed of multicore processors and multiple accelerators, simple offloading approaches in which the main trunk of the ap...