Sciweavers

671 search results - page 40 / 135
» Computer Aided Modelling Exercises
Sort
View
SLIP
2009
ACM
14 years 4 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
DAC
2003
ACM
14 years 3 months ago
Realizable RLCK circuit crunching
Reduction of an extracted netlist is an important pre-processing step for techniques such as model order reduction in the design and analysis of VLSI circuits. This paper describe...
Chirayu S. Amin, Masud H. Chowdhury, Yehea I. Isma...
WSC
1997
13 years 11 months ago
MODSIM III - A Tutorial
This tutorial introduces the MODSIM III language, showing how its simulation "world view" together with its object-oriented architecture and built in graphics contribute...
John Goble
KDD
2006
ACM
153views Data Mining» more  KDD 2006»
14 years 10 months ago
Model compression
Often the best performing supervised learning models are ensembles of hundreds or thousands of base-level classifiers. Unfortunately, the space required to store this many classif...
Cristian Bucila, Rich Caruana, Alexandru Niculescu...
CGVR
2006
13 years 11 months ago
A Parametric Model for Automotive Packaging and Ergonomics Design
- This paper describes the capabilities of a parametric model developed to perform design and analysis tasks in the areas of advanced engineering activities during the development ...
Vivek Bhise, Anita Pillai