4084 search results - page 569 / 817 » Constraints in spatial structures |
113
click to vote
MICCAI
2004
Springer
16 years 5 months ago
2004
Springer
Abstract. The extraction of quantitative information through Intravascular Ultrasound (IVUS) images is a very important goal for the diagnostic and the therapy in atherosclerotic v...
144
click to vote
ICDE
2010
IEEE
16 years 4 months ago
2010
IEEE
The rise of GPS and broadband-speed wireless devices has led to tremendous excitement about a range of applications broadly characterized as "location based services". Cu...
133
click to vote
ICCAD
2006
IEEE
16 years 1 months ago
2006
IEEE
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
142
click to vote
CVPR
2010
IEEE
16 years 16 days ago
2010
IEEE
When classifying high-dimensional sequence data, traditional methods (e.g., HMMs, CRFs) may require large amounts of training data to avoid overfitting. In such cases dimensional...
150
click to vote
3DIC
2009
IEEE
15 years 11 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...