—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
Abstract. Many automatic testing, analysis, and verification techniques for programs can effectively be reduced to a constraint-generation phase followed by a constraint-solving ...
Vijay Ganesh, Adam Kiezun, Shay Artzi, Philip J. G...
— With advanced VLSI manufacturing technology in deep submicron (DSM) regime, we can integrate entire electronic systems on a single chip (SoC). Due to the complexity in SoC desi...
We present techniques to create convincing high-quality watercolor illustrations of plants. Mainly focusing on the real-time rendering, we introduce methods to abstract the visual...
Database application programs typically contain program units that use SQL statements to manipulate records in database instances. Testing the correctness of data manipulation by ...