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ERSA
2010
172views Hardware» more  ERSA 2010»
13 years 5 months ago
A Self-Reconfigurable Lightweight Interconnect for Scalable Processor Fabrics
Interconnect architecture is a primary research issue for emerging many-core processors. Packet switched Networks-on-Chip (NoCs) are considered key to success but since they delive...
Heiner Giefers, Marco Platzner
DFT
2006
IEEE
143views VLSI» more  DFT 2006»
14 years 1 months ago
Defect Tolerant and Energy Economized DSP Plane of a 3-D Heterogeneous SoC
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...
Vijay K. Jain, Glenn H. Chapman
MOBIQUITOUS
2005
IEEE
14 years 1 months ago
MAIPAN - Middleware for Application Interconnection in Personal Area Networks
This paper proposes the Middleware for Application Interconnection in Personal Area Networks (MAIPAN), a middleware that provides a uniform computing environment for creating dyna...
Miklós Aurél Rónai, Kristof F...
FCCM
2002
IEEE
171views VLSI» more  FCCM 2002»
14 years 15 days ago
Coarse-Grain Pipelining on Multiple FPGA Architectures
Reconfigurable systems, and in particular, FPGA-based custom computing machines, offer a unique opportunity to define application-specific architectures. These architectures offer...
Heidi E. Ziegler, Byoungro So, Mary W. Hall, Pedro...
CODES
2006
IEEE
14 years 1 months ago
A buffer-sizing algorithm for networks on chip using TDMA and credit-based end-to-end flow control
When designing a System-on-Chip (SoC) using a Networkon-Chip (NoC), silicon area and power consumption are two key elements to optimize. A dominant part of the NoC area and power ...
Martijn Coenen, Srinivasan Murali, Andrei Radulesc...