3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
Automotive companies are forced to continuously extend and improve their product line-up. However, increasing diversity, higher design complexity, and shorter development cycles c...
Axel Blumenstock, Christoph Schlieder, Markus M&uu...
Given that most elementary problems in database design are NP-hard, the currently used database design algorithms produce suboptimal results. For example, the current 3NF decompos...
Transient Signal Analysis (TSA) is a parametric device testing technique based on the analysis of dynamic (transient) current (iDDT) drawn by the core logic from the power supply ...
Object identification is a crucial step in most information systems. Nowadays, we have many different ways to identify entities such as surrogates, keys and object identifiers. Ho...