20024 search results - page 3945 / 4005 » Database Management Systems |
CODES
2007
IEEE
14 years 4 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
HICSS
2007
IEEE
14 years 4 months ago
2007
IEEE
Increased market dynamics, shorter product lifecycles and a higher customer involvement in product design have caused great changes to competitive conditions and many companies ar...
ICC
2007
IEEE
14 years 4 months ago
2007
IEEE
— The EPC Network is an industry proposal to build a global information architecture for objects carrying RFID tags with Electronic Product Codes (EPC). A so-called Object Naming...
ICC
2007
IEEE
14 years 4 months ago
2007
IEEE
—Limited spectrum resources, inefficient spectrum usage and increasing wireless communication necessitates a paradigm shift from the current fixed spectrum management policy to...
ICRA
2007
IEEE
14 years 4 months ago
2007
IEEE
— Recently it has been shown that an inverse depth parametrization can improve the performance of real-time monocular EKF SLAM, permitting undelayed initialization of features at...