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113
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
Abstract—Caches often employ write-back instead of writethrough, since write-back avoids unnecessary transfers for multiple writes to the same block. For several reasons, however...
118
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
137
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
Abstract—This paper presents a technique to perform arbitrary fixed permutations on streaming data. We describe a parameterized architecture that takes as input n data points st...
149
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
With the relentless scaling of semiconductor technology, the lifetime reliability of embedded multiprocessor platforms has become one of the major concerns for the industry. If th...
136
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...