Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
In this article we review standard null-move pruning and introduce our extended version of it, which we call verified null-move pruning. In verified null-move pruning, whenever th...
For a finite set of points S, the (monochromatic) Reverse Nearest Neighbor (RNN) rule associates with any query point q the subset of points in S that have q as its nearest neighb...
The development of successful metaheuristic algorithms such as local search for a difficult problems such as satisfiability testing (SAT) is a challenging task. We investigate an ...
Resources in virtual organizations are classified based on their local taxonomies. However, heterogeneity between these taxonomies is a serious problem for efficient cooperation p...