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Descriptive and Computational Complexity
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Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
14 years 9 months ago
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infoscience.epfl.ch
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
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