605 search results - page 118 / 121 » Design Principles for Combiners with Memory |
MICRO
2006
IEEE
14 years 2 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
SENSYS
2006
ACM
14 years 2 months ago
2006
ACM
From experience with wireless sensor networks it has become apparent that dynamic reprogramming of the sensor nodes is a useful feature. The resource constraints in terms of energ...
CONCUR
2005
Springer
14 years 2 months ago
2005
Springer
d Abstract) Vijay Saraswat1 and Radha Jagadeesan2 1 IBM T.J. Watson Research Lab 2 School of CTI, DePaul University Abstract. We present the concurrency and distribution primitives...
ICS
2005
Tsinghua U.
14 years 2 months ago
2005
Tsinghua U.
The combination of increasing component power consumption, a desire for denser systems, and the required performance growth in the face of technology-scaling issues are posing eno...
LCTRTS
2005
Springer
14 years 2 months ago
2005
Springer
Effective use of the memory hierarchy is critical for achieving high performance on embedded systems. We focus on the class of streaming applications, which is increasingly preval...