Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
This paper presents the Evospaces reverse-engineering tool that represents the architecture and metrics of complex software systems in a 3D virtual world. The main goal of our pro...
The EvoSpaces reverse-engineering tool represents the architecture and metrics of complex software systems as 3D software cities. By navigating and interacting with this world, th...
Recently, research in 3D computer graphics and interaction has started to move beyond the narrow domain of single object authoring and inspection, and has begun to consider comple...
James McCrae, Michael Glueck, Tovi Grossman, Azam ...