—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
In deep sub-micron technology, the crosstalk effect between adjacent wires has become an important issue, especially between long on-chip buses. This effect leads to the increas...
One of today’s challenges is producing reliable software in the face of an increasing number of interacting components. Our system CHET lets developers define specifications des...
: Scenarios/use cases have gained wide-spread use over the last couple of years. In software engineering they are mainly used to capture requirements and specify a system. Many sof...
In order to make frameworks easier to use we need to better understand the difficulties that programmers have with them. The questions that programmers ask give clues to the qual...