—The design of a collision avoidance system for trains implies the design of a MAC layer for their specific requirements. It should be efficient, reliable, use broadcast and su...
Cristina Rico Garcia, Andreas Lehner, Thomas Stran...
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
The design of the access networks of next generation broadband wireless systems requires special attention in the light of changing network characteristics. In this paper, we pres...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Modern integrated circuits (ICs) are becoming increasingly complex. The complexity makes it difficult to design, manufacture and integrate these high-performance ICs. The advent o...