4340 search results - page 165 / 868 » Designing for change |
133
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DAC
2007
ACM
16 years 5 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
120
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DAC
2007
ACM
16 years 5 months ago
2007
ACM
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
110
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DSD
2009
IEEE
15 years 11 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
165
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EUMAS
2006
15 years 5 months ago
2006
Current IT application domains such as web services and autonomic computing call for highly flexible systems, able to automatically adapt to changing operational environments as w...
146
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WSC
2000
15 years 5 months ago
2000
As part of the design of the next generation Naval Amphibious Transport Dock Ship (LPD17), simulation was used to evaluate the arrangement and flow of cargo on the ship and to int...