Sciweavers

475 search results - page 67 / 95
» Designs in Product Association Schemes
Sort
View
HIPEAC
2009
Springer
14 years 2 months ago
Adapting Application Mapping to Systematic Within-Die Process Variations on Chip Multiprocessors
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
Yang Ding, Mahmut T. Kandemir, Mary Jane Irwin, Pa...
DATE
2005
IEEE
110views Hardware» more  DATE 2005»
14 years 1 months ago
Yield Enhancement of Digital Microfluidics-Based Biochips Using Space Redundancy and Local Reconfiguration
attributed to the high regularity of memories, PAs and FPGAs, and the ease with which they can be tested and reconfigured to avoid faulty elements. Digital microfluidicsbased bioch...
Fei Su, Krishnendu Chakrabarty, Vamsee K. Pamula
GLOBECOM
2007
IEEE
13 years 9 months ago
The Quality-Energy Scalable OFDMA Modulation for Low Power Transmitter and VLIW Processor Based Implementation
: The improvement of spectral efficiency comes at the cost of exponential increment of signal processing complexity [1]. Hence, the energy-efficiency of baseband has recently turne...
Min Li, Bruno Bougard, Eduardo Lopez-Estraviz, And...
ICRA
2000
IEEE
163views Robotics» more  ICRA 2000»
13 years 11 months ago
The Anthropomorphic Biped Robot BIP2000
This paper describes the progress of the BIP2000 project. This project, in which four laboratories are involved for 4 years, as uimed at the realization of the lower part of an an...
Bernard Espiau, Philippe Sardain
HICSS
2006
IEEE
261views Biometrics» more  HICSS 2006»
14 years 1 months ago
e-Risk Management with Insurance: A Framework Using Copula Aided Bayesian Belief Networks
: e-business organizations are heavily dependent on distributed 24X7 robust information computing systems, for their daily operations. To secure distributed online transactions, th...
Arunabha Mukhopadhyay, Samir Chatterjee, Debashis ...