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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 8 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
ICWSM
2009
13 years 8 months ago
Gesundheit! Modeling Contagion through Facebook News Feed
Whether they are modeling bookmarking behavior in Flickr or cascades of failure in large networks, models of diffusion often start with the assumption that a few nodes start long ...
Eric Sun, Itamar Rosenn, Cameron Marlow, Thomas M....
DEBU
2010
128views more  DEBU 2010»
13 years 7 months ago
Designing Database Operators for Flash-enabled Memory Hierarchies
Flash memory affects not only storage options but also query processing. In this paper, we analyze the use of flash memory for database query processing, including algorithms that...
Goetz Graefe, Stavros Harizopoulos, Harumi A. Kuno...
DEBU
2010
159views more  DEBU 2010»
13 years 7 months ago
Accelerating In-Page Logging with Non-Volatile Memory
A great deal of research has been done on solid-state storage media such as flash memory and non-volatile memory in the past few years. While NAND-type flash memory is now being c...
Sang-Won Lee, Bongki Moon, Chanik Park, Joo Young ...
DEBU
2010
152views more  DEBU 2010»
13 years 7 months ago
Implementing an Append-Only Interface for Semiconductor Storage
Solid-state disks are currently based on NAND flash and expose a standard disk interface. To accommodate limitations of the medium, solid-state disk implementations avoid rewritin...
Colin W. Reid, Philip A. Bernstein
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