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CODES
2007
IEEE
14 years 2 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
TPDS
1998
122views more  TPDS 1998»
13 years 7 months ago
Managing Statistical Behavior of Large Data Sets in Shared-Nothing Architectures
—Increasingly larger data sets are being stored in networked architectures. Many of the available data structures are not easily amenable to parallel realizations. Hashing scheme...
Isidore Rigoutsos, Alex Delis
IPPS
2003
IEEE
14 years 1 months ago
A Novel Design Technology for Next Generation Ubiquitous Computing Architecture
Modern applications for mobile computing require high performance architectures. On the other hand, there are restrictions such as storage or power consumption. The use of recon...
Carsten Nitsch, Camillo Lara, Udo Kebschull
ECOOPW
1999
Springer
14 years 13 hour ago
The Role of Trust Management in Distributed Systems Security
Existing authorization mechanisms fail to provide powerful and robust tools for handling security at the scale necessary for today's Internet. These mechanisms are coming unde...
Matt Blaze, Joan Feigenbaum, Angelos D. Keromytis
HPCA
2009
IEEE
14 years 8 months ago
Elastic-buffer flow control for on-chip networks
This paper presents elastic buffers (EBs), an efficient flow-control scheme that uses the storage already present in pipelined channels in place of explicit input virtualchannel b...
George Michelogiannakis, James D. Balfour, William...