303 search results - page 4 / 61 » Dynamic thermal management via architectural adaptation |
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
ASPDAC
2006
ACM
14 years 1 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
EUROMICRO
2009
IEEE
14 years 2 months ago
2009
IEEE
—Real-time systems are increasingly used in dynamic changing environments with variable user needs, hosting real-time applications ranging in number and nature. This paper propos...
ICDCS
2000
IEEE
13 years 12 months ago
2000
IEEE
In light of advances in processor and networking technology, especially the emergenceof networkattached disks,the traditional clientserver architecture of file systems has become...
IPPS
2010
IEEE
13 years 5 months ago
2010
IEEE
Thermal management is critical for clusters because of the increasing power consumption of modern processors, compact server architectures and growing server density in data center...