14 search results - page 1 / 3 » Electrical modeling and characterization of 3-D vias |
ISCAS
2008
IEEE
14 years 5 months ago
2008
IEEE
Abstract— Electrical characterization of the resistance, capacitance, and inductance of inter-plane 3-D vias is presented in this paper. Both capacitive and inductive coupling be...
3DIC
2009
IEEE
14 years 5 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
MICCAI
2000
Springer
14 years 2 months ago
2000
Springer
This paper presents a deformable model for automatically segmenting objects from volumetric MR images and obtaining point correspondences, using geometric and statistical informati...
IPMI
2001
Springer
14 years 11 months ago
2001
Springer
This paper presents a Bayesian multi-scale three dimensional deformable template approach based on a medial representation for the segmentation and shape characterization of anatom...
MICCAI
2008
Springer
15 years 1 days ago
2008
Springer
In this paper we present a fully automated approach to the segmentation of pediatric brain tumors in multi-spectral 3-D magnetic resonance images. It is a top-down segmentation app...