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DATE
2004
IEEE
132views Hardware» more  DATE 2004»
14 years 2 months ago
Hybrid Architectural Dynamic Thermal Management
When an application or external environmental conditions cause a chip's cooling capacity to be exceeded, dynamic thermal management (DTM) dynamically reduces the power densit...
Kevin Skadron
DELTA
2004
IEEE
14 years 2 months ago
Scan Test of IP Cores in an ATE Environment
Manufacturing test of chips made of multiple IP cores requires different techniques if ATE is used. As scan chains are commonly used as access paths to the DUT, ATE architectures ...
Luca Schiano, Yong-Bin Kim, Fabrizio Lombardi
EH
2004
IEEE
115views Hardware» more  EH 2004»
14 years 2 months ago
Intrinsic Evolution of Digital-to-Analog Converters Using a CMOS FPTA Chip
The work presented here tackles the problem of designing a unipolar 6-bit digital-to-analog converter (DAC) with a voltage mode output by hardware evolution. Thereby a Field Progr...
Jörg Langeheine, Karlheinz Meier, Johannes Sc...
CIVR
2006
Springer
121views Image Analysis» more  CIVR 2006»
14 years 2 months ago
Finding Faces in Gray Scale Images Using Locally Linear Embeddings
The problem of face detection remains challenging because faces are non-rigid objects that have a high degree of variability with respect to head rotation, illumination, facial exp...
Samuel Kadoury, Martin D. Levine
FGR
2004
IEEE
323views Biometrics» more  FGR 2004»
14 years 2 months ago
Automatic 3D Reconstruction for Face Recognition
An analysis-by-synthesis framework for face recognition with variant pose, illumination and expression (PIE) is proposed in this paper. First, an efficient 2D-to-3D integrated fac...
Yuxiao Hu, Dalong Jiang, Shuicheng Yan, Lei Zhang,...