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CODES
2007
IEEE
16 years 12 days ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
ECRTS
2007
IEEE
16 years 12 days ago
On Scheduling and Real-Time Capacity of Hexagonal Wireless Sensor Networks
Since wireless ad-hoc networks use shared communication medium, accesses to the medium must be coordinated to avoid packet collisions. Transmission scheduling algorithms allocate ...
Shashi Prabh, Tarek F. Abdelzaher
HICSS
2007
IEEE
132views Biometrics» more  HICSS 2007»
16 years 12 days ago
Modeling the Economic Cost of Transmission Bottlenecks
— The purpose of this paper is to model the stochastic behavior of nodal prices and use the predicted price differences between zones as the basis for measuring the magnitude and...
Timothy D. Mount, Jaeuk Ju
HPDC
2007
IEEE
16 years 12 days ago
Towards adaptive, scalable, and reliable resource provisioning for wsrf-compliant applications
Although WSRF (Web Services Resource Framework) and Java-based hosting environment have been successful in dealing with the heterogeneity of resources and the diversity of applica...
Eun-Kyu Byun, Jae-Wan Jang, Jin-Soo Kim
ICC
2007
IEEE
163views Communications» more  ICC 2007»
16 years 12 days ago
Packet Dispatching Algorithms with the Static Connection Patterns Scheme for Three-Stage Buffered Clos-Network Switches
—Rapid expansion of the Internet and increasing demand for multimedia services fosters an immediate need for the development of new high-capacity networks capable of supporting t...
Janusz Kleban, Hugo Santos
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